Complementary Metal Oxide Semiconductor (CMOS) Device Having Gate Structures Connected By A Metal Gate Conductor

ABSTRACT

A complementary metal oxide semiconductor (CMOS) device including a substrate including a first active region and a second active region, wherein each of the first active region and second active region of the substrate are separated by from one another by an isolation region. A n-type semiconductor device is present on the first active region of the substrate, in which the n-type semiconductor device includes a first portion of a gate structure. A p-type semiconductor device is present on the second active region of the substrate, in which the p-type semiconductor device includes a second portion of the gate structure. A connecting gate portion provides electrical connectivity between the first portion of the gate structure and the second portion of the gate structure. Electrical contact to the connecting gate portion is over the isolation region, and is not over the first active region and/or the second active region.

BACKGROUND

The present disclosure relates to semiconductor devices, and moreparticularly to electrical contacts to the gate structures ofsemiconductor devices.

Current complementary metal oxide semiconductor (CMOS) technology usessilicides as contacts to source/drain (S/D) regions and gate structuresof the n-type and p-type semiconductor devices. In order to be able tomake integrated circuits (ICs), such as CMOS devices, of higherintegration density than currently feasible, one has to find ways tofurther downscale the dimensions of field effect transistors (FETs).Scaling achieves compactness and improves operating performance indevices by shrinking the overall dimensions and operating voltages ofthe device while maintaining the device's electrical properties.However, with increased scaling, the etch processes that are typicallyused in forming the semiconductor devices may not have thecontrollability that is required for manufacturing.

SUMMARY

In one embodiment, a complementary metal oxide semiconductor (CMOS)device is provided that includes a substrate including at least onefirst active region and at least one second active region, wherein eachof the at least one first active region and each of the at least onesecond active region of the substrate are separated from one another byan isolation region positioned therebetween. An n-type semiconductordevice is present on at least one of the first active regions of thesubstrate, in which the n-type semiconductor device includes a firstportion of a gate structure including at least one gate conductor layer.A p-type semiconductor device is present on at least one of the secondactive regions of the substrate, in which the p-type semiconductordevice includes a second portion of the gate structure that includes theat least one gate conductor layer. Electrical connectivity between thefirst portion of the gate structure and the second portion of the gatestructure is provided by a connecting gate portion that is present onthe isolation region. An interconnect is in direct contact with an uppersurface of the at least one gate conductor layer of the connectingportion of the gate structure. A dielectric cap layer is present on theupper surface of the first portion of the gate structure in the at leastone first active region, and is present on the upper surface of thesecond portion of the gate structure in the at least one second activeregion.

In another aspect, a method of forming a complementary metal oxidesemiconductor (CMOS) device is provided, which in one embodiment mayinclude forming at least one isolation region in a substrate to provideat least one first active region and at least one second active region,and forming a gate structure extending across the at least one isolationregion and spanning from the at least one first active region to the atleast one second active region. The gate structure includes at least onegate dielectric layer, at least one gate conductor layer, and at leastone dielectric cap layer. A first source region and a first drain regionof a first conductivity type are formed on opposing sides of the gatestructure in the at least one first active region. A second sourceregion and a second drain region of a second conductivity type areformed on opposing sides of the gate structure in the at least onesecond active region. An opening is formed in a portion of the at leastone dielectric cap layer to expose a contact portion of the at least onegate conductor layer over the at least one isolation region, in which aremaining portion of the at least one dielectric cap layer is presentover the at least one first active region and the at least one secondactive region. An interconnect is formed in direct contact with thecontact portion of the at least one gate conductor layer.

DESCRIPTION OF THE DRAWINGS

The following detailed description, given by way of example and notintended to limit the disclosure solely thereto, will best beappreciated in conjunction with the accompanying drawings, wherein likereference numerals denote like elements and parts, in which:

FIG. 1A is a top down planar view of a substrate including first activeregions and second active regions, wherein each of the first activeregions and each of the second active regions of the substrate areseparated by from one another by an isolation region positionedtherebetween, in accordance with one embodiment of the presentdisclosure.

FIG. 1B is a side cross-sectional view along section line B-B of FIG.1A.

FIG. 2A is a top down planar view that depicts forming gate structuresextending across the isolation region and spanning from the first activeregions to the second active regions, wherein each of the gatestructures includes a dielectric cap layer, a semiconductor gateconductor layer, a metal gate conductor layer and a gate dielectriclayer, in accordance with one embodiment of the present disclosure.

FIG. 2B is a side cross-sectional view along section line B-B of FIG.2A.

FIG. 2C is a side cross-sectional view along section line C-C of FIG.2A.

FIG. 3A is a top down planar view that depicts forming an opening in aportion of the dielectric cap layer to expose a contact portion of thesemiconductor gate conductor layer over the isolation region, wherein aremaining portion of the dielectric cap layer is present over the firstactive regions and the second active regions, in accordance with oneembodiment of the present disclosure.

FIG. 3B is a side cross-sectional view along section line B-B of FIG.3A.

FIG. 3C is a side cross-sectional view along section line C-C of FIG.3A.

FIG. 3D is a side cross-sectional view along section line D-D of FIG.3A.

FIG. 4A is a top down planar view that depicts forming a metalsemiconductor alloy in the opening through the dielectric cap layer,wherein the metal semiconductor alloy is only present over the isolationregion and does not extend over the first active regions and the secondactive regions, in accordance with one embodiment of the presentdisclosure.

FIG. 4B is a side cross-sectional view along section line B-B of FIG.4A.

FIG. 4C is a side cross-sectional view along section line C-C of FIG.4A.

FIG. 4D is a side cross-sectional view along section line D-D of FIG.4A.

FIGS. 5A and 5B depict forming an interconnect in contact with the metalsemiconductor alloy depicted in FIGS. 4A-4D, in which FIG. 5A is a sidecross-sectional view along section line C-C as depicted in FIG. 4B andFIG. 5B is a side cross-sectional view along section line D-D asdepicted in FIG. 4B, in accordance with one embodiment of the presentdisclosure.

FIGS. 6A-6C depict another embodiment of the present disclosure in whichgate structures are formed extending across the isolation region andspanning from the first active regions to the second active regions, inwhich each of the gate structures includes a dielectric cap layer over ametal gate conductor layer that is present over a gate dielectric layer.FIG. 6A is a top down planar view. FIG. 6B is a side cross-sectionalview along section line B-B as depicted in FIG. 6A. FIG. 6C is a sidecross-sectional view along section line C-C as depicted in FIG. 6A.

FIGS. 7A and 7B depict forming a contact in electrical contact with theexposed portion of the metal gate conductor layer depicted in FIGS.6A-6D, in which FIG. 7A is a side cross-sectional view along sectionline C-C as depicted in FIG. 6B and FIG. 7B is a side cross-sectionalview along section line D-D as depicted in FIG. 6B, in accordance withone embodiment of the present disclosure.

DETAILED DESCRIPTION

Detailed embodiments of the present disclosure are described herein;however, it is to be understood that the disclosed embodiments aremerely illustrative of the methods and structures that may be embodiedin various forms. In addition, each of the examples given in connectionwith the various embodiments of the disclosure is intended to beillustrative, and not restrictive.

Further, the figures are not necessarily to scale, some features may beexaggerated to show details of particular components. Therefore,specific structural and functional details disclosed herein are not tobe interpreted as limiting, but merely as a representative basis forteaching one skilled in the art to variously employ the methods andstructures of the present disclosure.

It has been determined that removing the dielectric cap layer from theupper surface of a semiconductor gate conductor layer prior to forming ametal semiconductor alloy, such as a silicide contact, on the portion ofthe gate structure that is overlying the channel region of semiconductordevices may become particularly challenging as semiconductor devices arescaled to increasing smaller dimensions. For example, if the etchprocess for removing the dielectric cap layer does not remove the gatedielectric cap in its entirety, yield of semiconductor devices duringmanufacturing may be degraded. In another example, the etch process forremoving the dielectric cap from the portion of the gate conductor thatis overlying the channel damages the dielectric spacers that areabutting the gate structure, which may degrade semiconductor deviceperformance.

FIGS. 1A-5B depict one embodiment of the present disclosure thatovercomes the above disadvantages by removing a portion of thedielectric cap layer 20 of the gate structure 10 a, 10 b to expose anunderlying portion of the semiconductor gate conductor layer 15 a thatis present on an isolation region 5, and by forming an interconnect 55to the exposed portion of the semiconductor gate conductor layer 15 a.Because the interconnect 55 is formed to a portion of the gate structure10 a, 10 b that is present over the isolation region 5, the method ofthe present disclosure does not damage the portions of the gatestructure 10 a, 10 b that are present over the active regions 25 a, 25b, 30 a, 30 b of the substrate 1 with the process steps that form theinterconnect 55. Further, during the process sequence that provides theinterconnect 55 to the gate structures 10 a, 10 b, the active regions 25a, 25 b, 30 a, 30 b themselves are protected from being damaged.

As used herein, a “semiconductor device” is an intrinsic semiconductormaterial that has been doped, i.e., into which a doping agent has beenintroduced, giving it different electrical properties than the intrinsicsemiconductor. Doping involves adding dopant atoms to an intrinsicsemiconductor, which changes the electron and hole carrierconcentrations of the intrinsic semiconductor at thermal equilibrium.Dominant carrier concentration in an extrinsic semiconductor determinesthe conductivity type of the semiconductor. Although the semiconductordevices that are depicted in figures of the present disclosure are fieldeffect transistors (FET), it is noted that any semiconductor device thatincludes a gate structure to switch the device from an “on” state to an“off” state is suitable for use with the methods and structures of thepresent disclosure. A “field effect transistor (FET)” is a semiconductordevice in which the output current, i.e., source-drain current, iscontrolled by the voltage applied to the gate. A FET has threeterminals, i.e., gate structure, source region and drain region. Theterm “gate structure” means a structure used to control output current(i.e., flow of carriers in the channel) of a semiconducting devicethrough electrical or magnetic fields.

In one embodiment, the method of the present disclosure may begin withproviding a substrate 1 including first active regions 25 a, 25 b andsecond active regions 30 a, 30 b, wherein each of the first activeregions 25 a, 25 b and each of the second active regions 30 a, 30 b ofthe substrate 1 are separated by from one another by an isolation region5 positioned therebetween. Although the supplied figures only depict twofirst active regions 25 a, 25 b and two second active regions 30 a, 30b, it is not intended that the present disclosure be limited to onlythis embodiment, as any number of active regions 25 a, 25 b, 30 a, 30 bin the substrate 1 are within the scope of the present disclosure. Thesubstrate 1 may be composed of a silicon containing material. Siliconcontaining materials suitable for the substrate 1 include, but are notlimited to, Si, single crystal Si, polycrystalline Si, SiGe, singlecrystal silicon germanium, polycrystalline silicon germanium, or silicondoped with carbon, amorphous Si and combinations and multi-layersthereof. The substrate 1 may also be composed of other semiconductormaterials, such as germanium, and compound semiconductor substrates,such as type III/V semiconductor substrates, e.g., GaAs. Although thesubstrate 1 is depicted as a bulk semiconductor substrate, semiconductoron insulator (SOI) substrate arrangements, such as silicon on insulatorsubstrates, are also suitable for the substrate 1.

The substrate 1 may be etched to provide a trench that defines the atleast one first active region 25 a, 25 b and the at least one secondactive region 30 a, 30 b. In one embodiment, the trench is formed usinga dry etching process, such as reactive-ion etching (RIE) or plasmaetching. Following formation, the trench is filled with a dielectric toprovide an isolation region 5. Prior to deposition of the filldielectric, the trenches may be lined with a liner material that mayfunction as a diffusion barrier, e.g., a silicon nitride liner. Chemicalvapor deposition (CVD) or another like deposition process may be used tofill the trench with a dielectric material, such as silicon oxide(SiO₂). The dielectric that is deposited within the trench mayoptionally be densified after deposition. A planarization process, suchas chemical-mechanical polishing (CMP), may optionally be used toprovide a planar structure.

The terms “active” as used to describe the first active regions 25 a, 25b and the second active regions 30 a, 30 b means that the designatedportion of the substrate 1 contains at least the channel region, thesource region and the drain region of a semiconductor device. In someembodiments, a raised source region and a raised drain region may becontained within the active region. In one embodiment, the first activeregions 25 a, 25 b provide the site for a subsequently formed n-typesemiconductor devices, and the second active regions 30 a, 30 b providethe sites for subsequently formed p-type semiconductor devices. In thisexample, the first active regions 25 a, 25 b may include a well regionof a p-type conductivity, and the second active regions 30 a, 30 b mayinclude a well region of an n-type conductivity. As used herein, theterm “conductivity type” denotes a dopant region being p-type or n-type.As used herein, “p-type” refers to the addition of impurities to anintrinsic semiconductor that creates deficiencies of valence electrons.In a semiconductor material from group IV of the Periodic Table ofElements, such as silicon, examples of n-type dopants, i.e., impurities,include but are not limited to, boron, aluminum, gallium and indium. Asused herein, “n-type” refers to the addition of impurities thatcontributes free electrons to an intrinsic semiconductor. In asemiconductor material from group IV of the Periodic Table of Elements,examples of n-type dopants, i.e., impurities, include but are notlimited to antimony, arsenic and phosphorous. The concentration ofdopant in the well region of the first active regions 25 a, 25 b, and/orthe second active regions 30 a, 30 b may range from 1e16 atoms/cm³ to1c20 atoms/cm³.

FIGS. 2A-2C depict one embodiment of forming gate structures 10 a, 10 bextending across the isolation region 5 and spanning from the firstactive regions 25 a, 25 b to the second active regions 30 a, 30 b. Eachof the gate structures 10 a, 10 b may include at least one dielectriccap layer 20, at least one semiconductor gate conductor layer 15 a, atleast one metal gate conductor layer 15 b and at least one gatedielectric layer 4.

The at least one gate dielectric layer 4 can be formed by a thermalgrowing process, such as, e.g., oxidation, nitridation oroxynitridation. Alternatively, the at least one gate dielectric layer 4can be formed by a deposition process such as, for example, chemicalvapor deposition (CVD), plasma-assisted CVD, atomic layer deposition(ALD), evaporation, reactive sputtering, chemical solution depositionand other like deposition processes. The at least one gate dielectriclayer 4 may also be formed utilizing any combination of the aboveprocesses.

The at least one gate dielectric layer 4 may be comprised of aninsulating material including, but not limited to, an oxide, nitride,oxynitride and/or silicate. In one embodiment, the at least one gatedielectric layer 4 may be comprised of an oxide such as, for example,SiO₂, HfO₂, ZrO₂, Al₂O₃, TiO₂, La₂O₃, SrTiO₃, LaAlO₃, and mixturesthereof, including the addition of silicon and nitrogen. The at leastone gate dielectric layer 4 may also be composed of a high-k dielectricmaterial. As used herein, the term “high-k” denotes a dielectricmaterial having a dielectric constant at room temperature (e.g., 20° C.to 25° C.) that is greater than the dielectric constant of silicon oxide(SiO₂). For example, in one embodiment, the high-k dielectric materialthat provides the at least one high-k gate dielectric layer 4 may have adielectric constant at room temperature, and atmospheric pressure, e.g.,1 atm, of 4.0 or greater. In another embodiment, the high-k dielectricmaterial that provides the at least one gate dielectric layer 4 has adielectric constant that is greater than 7.0. The high-k dielectricmaterial of the at least one gate dielectric layer 4 may include, but isnot limited to, an oxide, nitride, oxynitride and/or silicate includingmetal silicates and nitrided metal silicates. In one embodiment, the atleast one gate dielectric layer 4 is comprised of an oxide such as, forexample, HfO₂, ZrO₂, Al₂O₃, TiO₂, La₂O₃, SrTiO₃, LaAlO₃, Y₂O₃ andmixtures thereof. Other examples of high-k dielectrics suitable for useas the at least one gate dielectric layer 4 in the present methodinclude hafnium silicate and hafnium silicon oxynitride. The physicalthickness of each layer of the at least one gate dielectric layer 4 mayvary, but typically, the at least one gate dielectric layer 4 has athickness from 0.5 nm to 10 nm, with a thickness from 0.5 nm to 3 nmbeing more typical. After forming the at least one gate dielectric layer4, blanket material layers for the gate electrodes are formed on the atleast one gate dielectric layer 4 utilizing a deposition process, suchas physical vapor deposition (PVD), CVD or evaporation. Although the atleast one gate dielectric layer 4 is depicted as being a single materiallayer in the supplied figures, it is noted that the at least one gatedielectric layer 4 may be a multilayered structure of any number ofdielectric compositions.

The gate electrode of the gate structures 10 a, 10 b may be amultilayered structure including at least one metal gate conductor layer15 b that is present in direct contact with the at least one gatedielectric layer 4, and at least one semiconductor gate conductor layer15 a that is present on the at least one metal gate conductor layer 15b. In one embodiment, the at least one metal gate conductor layer 15 bis formed in direct contact with the gate dielectric layer 4. By “metalgate conductor layer” it is meant that the conductive structure iscomposed of metal elements, and that the metal gate conductor layer isnot composed of a semiconductor element. The only possibility ofsemiconductor elements in the metal gate conductor layer is fromintermixing, which would only be at the interface between the at leastone metal gate conductor layer 15 b and the at least one semiconductorgate conductor layer 15 a. Examples of metals that can be used for theat least one metal gate conductor layer 15 b include, but are notlimited to: Al, W, Cu, Ti or other like conductive metals.

Although only one metal gate conductor layer 15 b is depicted in FIGS.2A-2C, it is noted that the at least one metal gate conductor layer 15 bmay be a multilayered structure having any number of metal compositions.Each layer of the at least one metal gate conductor layer 15 b may havea thickness ranging from 1 nm to 30 nm. In another embodiment, the atleast one metal gate conductor layer 15 b has a thickness ranging from 2nm to 7 nm.

In some embodiments, the at least one metal gate conductor layer 15 bmay be composed of a work function metal layer. In one embodiment, inwhich the semiconductor device is an n-type semiconductor device, suchas an nFET, the work function metal layer that provides the at least onemetal gate conductor layer 15 b is an n-type work function metal layer.As used herein, an “n-type work function metal layer” is a metal layerthat effectuates an n-type threshold voltage shift. As used herein,“threshold voltage” is the lowest attainable gate voltage that will turnon a semiconductor device, e.g., transistor, by making the channel ofthe device conductive. “N-type threshold voltage shift” as used hereinmeans a shift in the Fermi energy of an n-type semiconductor devicetowards a conduction band of silicon in a silicon-containing substrateof the n-type semiconductor device. The “conduction band” is the lowestlying electron energy band of the doped material that is not completelyfilled with electrons. In one embodiment, the work function of then-type work function metal layer ranges from 4.1 eV to 4.3 eV. In oneembodiment, the n-type work function metal layer is composed of at leastone of TiAl, TaN, TiN, HfN, or combinations thereof. The n-type workfunction metal layer can be deposited using chemical vapor deposition(CVD), atomic layer deposition (ALD), sputtering or plating. In oneembodiment, the n-type work function metal layer is composed of titaniumaluminum (TiAl) and is deposited using sputtering. Examples ofsputtering apparatus that may be suitable for depositing the n-type workfunction metal layer include DC diode type systems, radio frequency (RF)sputtering, magnetron sputtering, and ionized metal plasma (IMP)sputtering.

In another embodiment, in which the semiconductor device is a pFET, theat least one metal gate conductor layer 15 b may be a p-type workfunction metal layer. As used herein, a “p-type work function metallayer” is a metal layer that effectuates a p-type threshold voltageshift. In one embodiment, the work function of the p-type work functionmetal layer ranges from 4.9 eV to 5.2 eV. The term “p-type thresholdvoltage shift” as used herein means a shift in the Fermi energy of ap-type semiconductor device towards a valence band of silicon in thesilicon containing substrate of the p-type semiconductor device. A“valence band” is the highest range of electron energies where electronsare normally present at absolute zero.

In one embodiment, the p-type work function metal layer may be composedof titanium and their nitrided/carbide. In one embodiment, the p-typework function metal layer is composed of titanium nitride (TiN). Thep-type work function metal layer may also be composed of TiAlN, Ru, Pt,Mo, Co and alloys and combinations thereof. In one embodiment, thep-type work function metal layer comprising titanium nitride (TiN) maybe deposited by a physical vapor deposition (PVD) method, such assputtering. Examples of sputtering apparatus that may be suitable fordepositing the p-type work function metal layer include DC diode typesystems, radio frequency (RF) sputtering, magnetron sputtering, andionized metal plasma (IMP) sputtering. In addition to physical vapordeposition (PVD) techniques, the p-type work function metal layer mayalso be formed using chemical vapor deposition (CVD) and atomic layerdeposition (ALD).

In one embodiment, a semiconductor gate conductor layer 15 a is formedin direct contact with the metal gate conductor layer 15 b. By“semiconductor gate conductor layer” it is meant that the gate conductoris composed of semiconductor element that is free of metal elements. Thesemiconductor gate conductor layer 15 a may be composed of a siliconcontaining material. Examples of silicon containing materials suitablefor the semiconductor gate conductor layer 15 a include, but are notlimited to, silicon, single crystal silicon, polycrystalline silicon,silicon germanium, and amorphous silicon.

In one embodiment, the at least one semiconductor gate conductor layer15 a is provided by a doped semiconductor, such as n-type dopedpolysilicon. Although the at least one semiconductor gate conductorlayer 15 a is depicted as being a single material layer, it is notedthat the at least one semiconductor gate conductor layer 15 a may becomposed of any number of semiconductor layers having any number ofcompositions. The at least one semiconductor gate conductor layer 15 amay have a thickness that is as great as 100 nm. In another embodiment,at least one semiconductor gate conductor layer 15 a may have athickness ranging from 10 nm to 20 nm.

In one embodiment, the at least one semiconductor gate conductor layer15 a is deposited and then doped by ion implantation. The material forthe semiconductor gate conductor layer 15 a may be deposited usingchemical vapor deposition (CVD). Variations of CVD processes suitablefor depositing the material that provides the at least one semiconductorgate conductor layer 15 a include, but are not limited to, AtmosphericPressure CVD (APCVD), Low Pressure CVD (LPCVD) and Plasma Enhanced CVD(EPCVD), Metal-Organic CVD (MOCVD) and others. The at least onesemiconductor gate conductor layer 15 a may be doped using ionimplantation following the deposition of the material for the at leastone semiconductor gate conductor layer 15 a. In another embodiment, theat least one semiconductor gate conductor layer 15 a may be in-situdoped as the material layer for the at least one semiconductor gateconductor layer 15 a is formed. The dopant concentration in thesemiconductor gate conductor layer 15 a may range from 1×10¹⁹atoms/cm³to 1×10²¹ atoms/cm³.

The at least one dielectric cap layer 20 may present in direct contactwith the at least one semiconductor gate conductor layer 15 a. The atleast one dielectric cap layer 20 may be composed of a dielectricmaterial that can be etched selectively to the at least onesemiconductor containing gate conductor 15 a. For example, the at leastone dielectric cap layer 20 may be composed of an oxide, nitride oroxynitride material. It is noted that the above materials for the atleast one dielectric cap layer 20 are provided for illustrative purposesonly, and are not intended to limit the present disclosure, as anydielectric material may be utilized for the at least one dielectric caplayer 20. For example, any material having a room temperature, e.g., 20°C. to 25° C., conductivity that is less than about 10⁻¹⁰(Ω-m)⁻¹ maybeemployed for the at least one dielectric cap layer 20. In oneembodiment, the at least one dielectric cap layer 20 may have athickness that is as great as 70 nm. In another embodiment, thedielectric cap layer 30 may have a thickness ranging from 10 nm to 20nm. Although the at least one dielectric cap layer 20 is depicted as asingle material layer in the supplied figures, the at least onedielectric cap layer 20 may be composed of any number of materiallayers, and may include any number of compositions.

In one embodiment, the gate structures 10 a, 10 b are formed bydepositing blanket layers for each of the at least one gate dielectriclayer 4, the at least one metal gate conductor layer 15 b, the at leastone semiconductor gate conductor layer 15 a, and the at least onedielectric cap layer 20 to form a gate stack, and then patterning andetching are performed on the gate stack to form the gates structures 10a, 10 b. More specifically, a pattern is produced on the gate stack byapplying a photoresist to the surface to be etched, exposing thephotoresist to a pattern of radiation, and then developing the patterninto the photoresist utilizing a resist developer. Once the patterningof the photoresist is completed, the sections covered by the photoresistare protected, while the exposed regions are removed using a selectiveetching process that removes the unprotected regions. As used herein,the term “selective” in reference to a material removal process denotesthat the rate of material removal for a first material is greater thanthe rate of removal for at least another material of the structure towhich the material removal process is being applied. For example, afirst material may be removed with a selectivity of greater than 100:1to a second material. It is noted that separate material stacks may beformed for to provide each of the gate structures 10 a, 10 b so that thecompositions for the first gate structure 10 a may differ from thesecond gate structure 10 b. The remaining portion of the gate stacksthat provides the gate structures 10 a, 10 b is positioned on at leastchannel region of the first active regions 25 a, 25 b and the secondactive regions 30 a, 30 b. In the embodiment that is depicted in FIGS.2A-2C, each of the first and second gate structures 10 a, 10 b extendfrom a first active region 25 a, 25 b, across the isolation region 5 toa second active region 30 a, 30 b. Although only two gate structures 10a, 10 b are depicted in the supplied figures, any number of gatestructures 10 a, 10 b are within the scope of the present disclosure.

FIGS. 2A-2C also depict one embodiment of forming at least one spacer 6on the sidewall of the gate structures 10 a, 10 b, and forming sourceregions 11 a, 11 b, 11 c, 11 d and drain regions 12 a, 12 b, 12 c, 12 din the semiconductor substrate 1. The material of the at least onespacer 6 is typically a dielectric material. For example, the at leastone spacer 6 may be an oxide, nitride or oxynitride material. In oneexample, the at least one spacer 6 is composed of silicon oxide. Inanother example, the at least one spacer 6 is composed of siliconnitride. In one embodiment, the material layer for the at least onespacer 6 may be formed using thermal growth or deposition in combinationwith etching. In one embodiment, the at least one spacer 6 was a widththat ranges from 1.0 nm to 50.0 nm. In another embodiment, the at leastone spacer 6 has a width that ranges from 10.0 nm to 20.0 nm.

In one embodiment, the source regions 11 a, 11 b, 11 c, 11 d and thedrain regions 12 a, 12 b, 12 c, 12 d are formed on opposing sides of thegate structures 10 a, 10 b within the substrate 1 for each of the firstactive regions 25 a, 25 b and the second active regions 30 a, 30 b. Asused herein, the term “source” is a doped region in the semiconductordevice, in which majority carriers are flowing into the channel. As usedherein, the term “channel” is the region underlying the gate structureand between the source region and drain region of a semiconductor devicethat becomes conductive when the semiconductor device is turned on. Theterm “drain” means a doped region in semiconductor device located at theend of the channel, in which carriers are flowing out of thesemiconductor device through the drain. Each of the source regions 11 a,11 b, 11 c, 11 d and the drain regions 12 a, 12 b, 12 c, 12 d mayinclude an extension region and a deep implant region. In someembodiments, the source regions 11 a, 11 b, 11 c, 11 d and the drainregions 12 a, 12 b, 12 c, 12 d may each include a halo dopant regionthat is adjacent to the channel, wherein the halo dopant region has aconductivity that is typically opposite the extension regions and thedeep implant regions. In the embodiments, in which the first activeregions 25 a, 25 b are processed to provide the sites for n-typesemiconductor devices, the source and drain regions 11 a, 12 a, 11 d, 12d are doped to an n-type conductivity. In the embodiments, in which thesecond active regions 30 a, 30 b are processed to provide the sites forp-type semiconductor devices, the source and drain regions 11 b, 12 b,11 c, 12 d are doped to a p-type conductivity. The dopant for the sourceand drain regions 11 a, 11 b, 11 c, 11 d, 12 a, 12 b, 12 c, 12 d may beintroduced to the first and second active regions 25 a, 25 b, 30 a, 30 bof the substrate 1 using ion implantation.

In one embodiment, forming the source and drain regions 11 a, 11 b, 11c, 11 d, 12 a, 12 b, 12 c, 12 d includes forming a first block mask (notshown) over the at least one second active region 30 a, 30 b, implantingthe first conductivity type dopant to provide the source regions 11 a,11 d and the drain regions 12 a, 12 d in the at least one first activeregion 25 a, 25 b, removing the first block mask, forming a second blockmask (not shown) over the at least one first active region 25 a, 25 b,and implanting the second conductivity type dopant to provide the sourceregions 11 b, 11 c and the drain regions 12 b, 12 c in the at least onesecond active region 30 a, 30 b. The concentration of dopant in thesource and drain regions 11 a, 11 b, 11 c, 11 d, 12 a, 12 b, 12 c, 12 dof the first active region 25 a, 25 b, and/or the second active region30 a, 30 b may range from 1×10¹⁸ atoms/cm³ to 1×10²¹ atoms/cm³.

In addition to the “gate first” process sequence that is describedabove, in which the gate structure 15 formed prior to the source regionsand the drain regions. The methods and structures disclosed herein areequally applicable to a “gate last” (also referred to as “replacementgate”) sequence. In a “gate last” process sequence, a replacement gateis first formed on the portion of the active device regions that providethe channel region of the semiconductor device. The source and drainregions may then be formed in the active device region while thereplacement gate is in place. Following the formation of the source anddrain regions, the replacement gate is removed and a functional gatestructure is formed in its' place. In some embodiments, the “gate last”process sequence may be employed to avoid subjecting the functional gatestructure to the activation anneal for the source and drain regions. Ina “gate first” process the activation anneal is typically performedafter doping the source and drain regions.

FIGS. 3A-3D depict one embodiment of forming an opening 40 in a portionof the at least one dielectric cap layer 20 to expose a contact portionof the at least one semiconductor gate conductor layer 15 b over theisolation region 5. The opening 40 may be formed using,photolithography, and selective etch processing. More specifically, anetch mask (not shown) may first be formed over the substrate 1 having anopening 40 corresponding to the portion of the at least one dielectriccap layer 20 that is over the isolation region 5. The etch mask maycomprise soft and/or hardmask materials and can be formed usingdeposition, photolithography and etching.

In one embodiment, the etch mask is composed of a photoresist material.A patterned photoresist can be produced by applying a blanketphotoresist layer to the surface of the substrate 1 covering the gatestructures 10 a, 10 b, exposing the photoresist layer to a pattern ofradiation, and then developing the pattern into the photoresist layerutilizing resist developer. In another embodiment, the etch mask iscomposed of a hardmask material. In one example, the hardmask may becomposed of a nitride-containing material, such as silicon nitride. Itis not intended that the etch mask be limited to only silicon nitride,as the composition of the hardmask may include any dielectric materialthat may be deposited by chemical vapor deposition (CVD) and relatedmethods. Other hardmask compositions for the etch mask may includesilicon oxides, silicon oxynitrides, silicon carbides, siliconcarbonitrides, etc. Spin-on dielectrics may also be utilized as ahardmask material including, but not limited to, silsequioxanes,siloxanes, and boron phosphate silicate glass (BPSG). In one embodiment,an etch mask comprising a hardmask material may be formed by blanketdepositing a layer of hardmask material, providing a patternedphotoresist atop the layer of hardmask material, and then etching thelayer of hardmask material to provide an etch mask protecting at leastthe portion of the gate structures 10 a, 10 b overlying the first activeregions 25 a, 25 b and the second active regions 30 a, 30 b. The openingformed in the layer of the hardmask material exposes a portion of thedielectric cap layer 20 that is present over isolation region 5 that isremoved to provide the opening.

In one embodiment, following formation of the etch mask, the exposedportion of the at least one dielectric cap layer 20 that is present overthe isolation region 5 is removed using an etch process to expose acontact portion of the at least one semiconductor gate conductor layer15 a. In one embodiment, the exposed portion of the at least onedielectric cap layer 20 is removed by an etch that is selective to theunderlying at least one semiconductor gate conductor layer 15 a, as wellas being selective to the etch mask. In one embodiment, the etch processmay be an anisotropic etch process, such as reactive ion etch (RIE). Theopening 40 that is formed through the at least one dielectric cap layer20 may have a length L1 ranging from 10 nm to 1×10⁶ nm, and a width W1ranging from 10 nm to 1×10⁸ nm. In another embodiment, the opening 40that is formed through the at least one dielectric cap layer 20 may havea length L1 ranging from 10 nm to 1000 nm, and a width W1 ranging from10 nm to 1000 nm. The opening 40 may be formed by a single mask, inwhich the opening through the single mask is depicted as M1 in FIG. 3A.

Following forming the opening 40 through the at least one dielectric caplayer 20 that is over the isolation region 5, a remaining portion of theat least one dielectric cap layer 20 is present over and protecting atleast a portion of the at least one semiconductor gate conductor layer15 a that is present in the first active regions 25 a, 25 b, and thesecond active regions 30 a, 30 b. In some embodiments, the etch maskthat is employed to form the opening 40 may remain over the first activeregions 25 a, 25 b and the second active regions 30 a, 30 b during theformation of the subsequently described metal semiconductor alloy andthe subsequently described interconnect. By remaining over the first andsecond active regions 25 a, 25 b, 30 a 30 b, the etch mask used to formthe opening 40 though the at least one dielectric layer 20 protects thefirst and second active regions 25 a, 25 b, 30 a, 30 b from thefollowing process steps used to form the metal semiconductor alloy andthe interconnect.

FIGS. 4A-4D depict forming a metal semiconductor alloy 50 in the openingthrough the at least one dielectric cap layer 20, wherein the metalsemiconductor alloy 50 is only present over the isolation region 5 anddoes not extend over the first active regions 25 a, 25 b and the secondactive regions 30 a, 30 b. A “metal semiconductor alloy” is an alloy ofa metal and semiconductor. An alloy is mixture or solid solution, inwhich the atoms of the metal are replacing or occupying interstitialpositions between the atoms of the semiconductor. Metal semiconductoralloy 50 formation typically requires depositing a metal, such ascobalt, nickel, or titanium, onto the surface of a semiconductorcontaining material. Following deposition, the structure is subjected toan annealing process such as, but not limited to, rapid thermalannealing. During thermal annealing, the deposited metal reacts withsemiconductor forming a metal semiconductor alloy. For example, a metalreacting with silicon as described above typically forms a silicide. Theremaining non-reacted metal is removed by an etch process selective tometal semiconductor alloy 50. In one example, the metal semiconductoralloy 50 may be composed of nickel silicide (NiSi_(x)). Other examplesof compositions for the metal semiconductor alloy 50 may include, nickelplatinum silicide (NiPt_(y)Si_(x)), cobalt silicide (CoSi_(x)), tantalumsilicide (TaSi_(x)), titanium silicide (TiSi_(x)) and combinationsthereof. Because the remaining portion of the at least one dielectriccap layer 20 is present over the first active regions 25 a, 25 b and thesecond active regions 30 a, 30 b, the metal semiconductor alloy 50 isobstructed from being formed on the portion of the at least onesemiconductor gate conductor 15 b that is present over first activeregions 25 a, 25 b and the second active regions 30 a, 30 b. In someembodiments, the etch mask used to form the opening may remain over thefirst active regions 25 a, 25 b and the second active regions 30 a, 30 bto obstruct the metal semiconductor alloy from being formed on the firstactive regions 25 a, 25 b and the second active regions 30 a, 30 b.Therefore, the metal semiconductor alloy 50 is only formed on thecontact portion of the at least one semiconductor gate conductor layer15 a that is exposed by the opening in the at least one dielectric caplayer 20, which is present over the isolation region 5.

FIGS. 5A and 5B depict one embodiment of forming interconnects 55 to themetal semiconductor alloy 50 that is present over the isolation region5. The interconnects 55 may be formed through an interlevel dielectriclayer (not shown) that is blanket deposited over the substrate 1. Theinterlevel dielectric layer may be selected from the group consisting ofsilicon containing materials such as SiO₂, Si₃N₄, SiO_(x)N_(y), SiC,SiCO, SiCOH, and SiCH compounds; the above-mentioned silicon containingmaterials with some or all of the Si replaced by Ge; carbon dopedoxides; inorganic oxides; inorganic polymers; hybrid polymers; organicpolymers such as polyamides or SiLK™; other carbon containing materials;organo-inorganic materials such as spin-on glasses andsilsesquioxane-based materials; and diamond-like carbon (DLC, also knownas amorphous hydrogenated carbon, α-C:H). Additional choices for theinterlevel dielectric layer include any of the aforementioned materialsin porous form, or in a form that changes during processing to or frombeing porous and/or permeable to being non-porous and/or non-permeable.The interlevel dielectric layer may then patterned and etched to formvia holes to the metal semiconductor alloy 50 that is present over theisolation region 5. Following via formation, interconnects 55 are formedby depositing a conductive metal into the via holes using depositionmethods, such as CVD, sputtering or plating. The conductive metal mayinclude, but is not limited to: tungsten, copper, aluminum, silver, goldand alloys thereof.

FIGS. 4A-4C depict a complementary metal oxide semiconductor (CMOS)device that includes a substrate 1 including at least one first activeregion 25 a, 25 b and at least one second active region 30 a, 30 b,wherein each of the at least one first active region 25 a, 25 b and eachof the at least one second active region 30 a, 30 b of the substrate 1are separated by from one another by an isolation region 5 positionedtherebetween. A semiconductor device 100 a, 100 c having n-typeconductivity source and drain regions 11 a, 12 a, 11 d, 12 d (hereafterreferred to as n-type semiconductor device 100 a) is present on theleast one of the first active region 25 a, 25 b of the substrate 1. Asemiconductor device 100 b, 100 d having p-type conductivity source anddrain regions 11 b, 12 b, 11 c, 12 c (hereafter referred to as a p-typesemiconductor device 100 b) is present on at least one of the secondactive region 30 a, 30 b of the substrate 1.

The n-type semiconductor device 100 a, 100 c includes a first portion ofa gate structure 10 a, 10 b and the p-type semiconductor device 100 b,100 d includes a second portion of the gate structure 10 a, 10 b,wherein the first and second portion of the gate structure 10 a, 10 bare separated by a connecting gate portion 90 that is present on theisolation region 5. As described above, each gate structure 10 a, 10 bincludes at least one gate dielectric layer 4, at least one metal gateconductor layer 15 b, at least one semiconductor gate conductor layer 15a, and at least one dielectric cap layer 20. The at least one dielectriccap layer 20 includes an opening there through over the isolation region5. A metal semiconductor alloy 50 is present in the opening providing anelectrical contact to the connecting gate portion 90 of the gatstructures 10 a, 10 b which is present over the isolation region 5.

Electrical communication between the first portion of the gate structure10 a, 10 b of the n-type semiconductor device 100 a, 100 c that ispresent on the first active region 25 a, 25 b and the second portion ofthe gate structure 10 a, 10 b of the p-type semiconductor device 100 b,100 d that is present on the second active region 30 a, 30 b is providedby a metal gate conductor layer 15 b (also referred to as metal gateconductor portion) that is common to both the first portion of the gatestructure 10 a, 10 b and the second portion of the gate structure 10 a,10 b. By “common” it is meant that the metal gate conductor layer 15 bof the first and second portions of the gate structure 10 a, 10 b andthe connecting portion 90 of the gate structure 10 a, 10 b are the samecontinuous metal gate conductor layer 15 b. By “electricalcommunication” it is meant that the electrical signal that dictates the“on” and/or “off' state of the n-type semiconductor device 100 a, 100 cand the p-type semiconductor device 100 b, 100 d is transmitted from themetal semiconductor alloy 50 to the underlying portion of thesemiconductor gate conductor layer 15 a to the metal gate conductorlayer 15 b over the isolation region 5, and is then transmitted from theportion of the metal gate conductor layer 15 b that is over theisolation region 5 to the portion of the metal gate conductor layer 15 bthat is present over the channel region of the n-type and p-typesemiconductor device 100 a, 100 b, 100 c, 100 d in the first and secondactive regions 25 a, 25 b, 30 a, 30 b of the substrate 1. The electricalsignal may be transmitted in both the doped silicon of the at least onesemiconductor gate conductor layer 15 a, and the metal gate conductorlayer 15 b over the isolation region 5 that is between the at least onefirst active region 25 a, 25 b and the at least one second active region30 a, 30 b.

FIGS. 6A-7B depict another embodiment of the present disclosure, inwhich each gate structure 10 c, 10 d is formed extending across theisolation region 5 and spanning from a first active region 25 a, 25 b,to a second active region 30 a 30 b, wherein the gate structure 10 c, 10d include at least one dielectric cap layer 200 over at least one metalgate conductor layer 150, in which the at least one metal gate conductorlayer 150 is present over at least one gate dielectric layer 400. The atleast one metal gate conductor layer 150 may be in direct contact withthe at least one dielectric cap layer 200, and the at least one metalgate conductor layer 150 may be in direct contact with the at least onegate dielectric layer 400. In this embodiment, the gate structure 10 c,10 d does not include a semiconductor gate conductor layer. In thisembodiment, interconnects 55 extend through the at least one dielectriccap layer 200 over the isolation region 5 into direct contact with anupper surface of the at least one metal gate conductor layer 150. In oneembodiment, because a semiconductor gate conductor layer is not presentover the at least one metal gate conductor layer 150, there are no metalsemiconductor alloy regions between the interconnects 55 and the atleast one metal gate conductor layer 150. Similar to the embodimentsdescribed above with reference to FIGS. 1A-5B, a remaining portion ofthe dielectric cap layer 200 is present over the first active regions 25a, 25 b and the second active regions 30 a, 30 b. Electrical contact bythe interconnect 55 to the gate structure 10 c, 10 d is only over theisolation region 5.

The structure depicted in FIGS. 6A-6C is similar to the structuredescribed above with reference to FIGS. 2A-2C. The composition,dimensions and method of forming the at least one dielectric cap layer200 that is depicted in FIGS. 6A-6C is similar to the composition,dimensions and method of forming the at least one dielectric cap layer20 that is described above with reference to FIGS. 2A-2C. Thecomposition, dimensions and method of forming the at least one metalgate conductor layer 150 that is depicted in FIGS. 6A-6C is similar tothe composition, dimensions and method of forming the at least one metalgate conductor layer 15 b that is described above with reference toFIGS. 2A-2C. The composition, dimensions and method of forming the gatedielectric layer 4 that is depicted in FIGS. 6A-6C is similar to thecomposition, dimensions and method of forming the gate dielectric layer4 that is described above with reference to FIGS. 2A-2C. The substrate1, isolation region 5, first active regions 25 a, 25 b, second activeregions 30 a, 30 b, source regions 11 a, 11 b, 11 c, 11 d, and drainregions 12 a, 12 b, 12 c, 12 d that are depicted in FIGS. 6A-6C havealso been described above with reference to FIGS. 1A-2C.

FIGS. 7A and 7B depict forming an interconnect 55 in contact with theexposed surface of the metal gate conductor layer 150. The interconnect55 that is depicted in FIGS. 7A and 7B is similar to the interconnect 55that is depicted in FIGS. 5A and 5B with the exception that theinterconnect 55 depicted in FIGS. 5A and 5B is formed in direct contactwith a metal semiconductor alloy 50 that is formed atop the uppersurface of the semiconductor gate conductor layer 15 a, and in FIGS. 7Aand 7B the interconnect 55 is in direct contact with the upper surfaceof the metal gate conductor layer 150. Therefore, the description offorming the interconnect 55 that is depicted in FIGS. 5A and 5B issuitable for forming the interconnect 55 that is depicted in FIGS. 7Aand 7B.

The metal gate conductor 150 that is depicted in FIGS. 6A-7B provideselectrical communication between the first portion of the gate structure10 c, 10 d of the n-type semiconductor device 100 a, 100 c that ispresent on the first active regions 25 a, 25 b and the second portion ofthe gate structure 10 c, 10 d of the p-type semiconductor device 100 b,100 d that is present on the second active regions 30 a, 30 b. The metalgate conductor 150 is common to both the first portion of the gatestructure 10 c, 10 d and the second portion of the gate structure 10 c,10 d. By “electrical communication” it is meant that the electricalsignal that dictates the “on” and/or “off” state of the n-typesemiconductor device 100 a, 100 c and p-type semiconductor device 100 b,100 d is transmitted from the interconnect 50 to the metal gateconductor layer 150 that is over the isolation region 5, and is thentransmitted from the portion of the metal gate conductor layer 150 thatis over the isolation region 5 to the portion of the metal gateconductor layer 150 that is present over the channel region of then-type and p-type semiconductor device 100 a, 100 b, 100 c, 100 d in thefirst and second active regions 25 a, 25 b, 30 a, 30 b of the substrate1.

In some embodiments, the methods disclosed herein protect the gatestructures that are overlying the active regions of the substrate whileremoving the dielectric cap layer that is over the gate structure inproviding electrical contact to the gate structures. The methods mayalso protect spacer integrity in the active regions of the substrate.The gate conductors in the active regions of the substrate are alsoprotected for silicidation processes that may short the devices.

While the claimed methods and structures has been particularly shown anddescribed with respect to preferred embodiments thereof, it will beunderstood by those skilled in the art that the foregoing and otherchanges in form and details may be made therein without departing fromthe spirit and scope of the presently claimed methods and structures.

What is claimed is:
 1. A complementary metal oxide semiconductor (CMOS)device comprising: a substrate including at least one first activeregion and at least one second active region, wherein each of the atleast one first active region and each of the at least one second activeregion of the substrate are separated from one another by an isolationregion positioned therebetween; an n-type semiconductor device on atleast one of said at least one first active region of the substrate, then-type semiconductor device comprising a first portion of a gatestructure including at least one gate conductor layer; a p-typesemiconductor device on at least one of said second active region of thesubstrate, the p-type semiconductor device comprising a second portionof the gate structure including the at least one gate conductor layer,wherein electrical connectivity between the first portion of the gatestructure and the second portion of the gate structure is provided by aconnecting gate portion that is present on the isolation region; aninterconnect in direct contact with an upper surface of the at least onegate conductor layer of the connecting gate portion of the gatestructure that is present on the isolation region; and a dielectric caplayer in direct contact with the upper surface of the at least one gateconductor layer of the first portion and the second portion of the gatestructure that is present on the least one first active region and theat least one second active region.
 2. The CMOS device of claim 1,wherein the gate structure comprises: at least one gate dielectric layerin contact with a portion of the at least one first active region andthe at least one second active region, and the at least one gateconductor comprises a metal gate conductor layer over the at least onegate dielectric layer, wherein the metal gate conductor layer provideselectrical communication between the first gate portion and the secondgate portion, and a semiconductor gate conductor layer over the metalgate conductor layer.
 3. The CMOS device of claim 2, wherein thesemiconductor gate conductor layer of the connecting portion of the gatestructure that is over the isolation region has an upper surface thatcomprises a metal semiconductor alloy.
 4. The CMOS device of claim 3,wherein the interconnect is in direct contact with the metalsemiconductor alloy.
 5. The CMOS device of claim 4, wherein a remainingupper surface of the semiconductor gate conductor layer that is notcontacted by the interconnect is in direct contact with the dielectriccap layer.
 6. The CMOS device of claim 1, wherein the gate structurecomprises: a gate dielectric layer in contact with a portion of the atleast one first active region and the at least one second active region,and the at least one gate conductor layer is a metal gate conductorlayer over the gate dielectric layer, wherein the metal gate conductorlayer provides electrical communication between the first gate portionand the second gate portion.
 7. The CMOS device of claim 1, wherein theinterconnect is in direct contact with a portion of the metal gateconductor layer that is over the isolation region.
 8. The CMOS device ofclaim 7, wherein a remaining upper surface of the metal gate conductorlayer that is not contacted the interconnect is in direct contact withthe dielectric cap layer.
 9. A method of forming a CMOS devicecomprising: forming at least one isolation region in a semiconductorsubstrate to provide at least one first active region and at least onesecond active region; forming a gate structure extending across the atleast one isolation region and spanning from the at least one firstactive region to the at least one second active region, wherein the gatestructure includes at least one gate dielectric layer, at least one gateconductor layer, and at least one dielectric cap layer; forming a firstsource region and a first drain region of a first conductivity type onopposing sides of the gate structure in the at least one first activeregion, and a second source region and a second drain region of a secondconductivity type on opposing sides of the gate structure in the atleast one second active region; forming an opening in a portion of theat least one dielectric cap layer to expose a contact portion of the atleast one gate conductor layer over the at least one isolation region,wherein a remaining portion of the at least one dielectric cap layer ispresent over the at least one first active region and the at least onesecond active region; and forming an interconnect in direct contact withthe contact portion of the at least one gate conductor layer.
 10. Themethod of claim 9, wherein the forming the first source region, thefirst drain region, the second source region, and the second drainregion comprises: forming a spacer adjacent to the gate structure in theat least one first active region and the at least one second activeregion; forming a first block mask over the at least one second activeregion; implanting the first conductivity type dopant in the at leastone first active region to provide the first source region and the firstdrain region; removing the first block mask; forming a second block maskover the at least one first active region; and implanting the secondconductivity type dopant in the at least one second active region toprovide the second source region and the second drain region.
 11. Themethod of claim 10, wherein the first conductivity type dopant is ann-type dopant and the second conductivity type dopant is a p-typedopant.
 12. The method of claim 10, wherein the at least one gateconductor layer comprises a metal gate conductor layer over the at leastone gate dielectric and a semiconductor gate conductor layer over themetal gate conductor layer.
 13. The method of claim 12, wherein prior toforming the interconnect, a metal semiconductor alloy is formed on thesemiconductor gate conductor layer to provide the contact portion of thegate structure.
 14. The method of claim 13, wherein the metalsemiconductor alloy that is formed on the contact portion of the gatestructure is only present over the isolation region and does not extendover at least one of the at least one first active region and the atleast one second active region.
 15. The method of claim 14, wherein theinterconnect is in direct contact with the metal semiconductor alloy.16. The method of claim 10, wherein the at least one gate conductorlayer comprises a metal gate conductor layer over the at least one gatedielectric.
 17. The method of claim 9, wherein the interconnect is indirect contact with the metal gate conductor layer.